Transition Metals
Copper rod, 25.4mm (1.0in) dia, Puratronic™, 99.995% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper gauze, 30 mesh woven from 0.15mm (0.006in) dia wire
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper rod, 5mm (0.2in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper sputtering target, 76.2mm (3.0 in.) dia. x 6.35mm (0.250 in.) thick, 99.995% (metals basis), Thermo Scientific™
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper rod, 7mm (0.3in) dia, Puratronic™, 99.999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.9985% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Scandium foil, 0.1mm (0.004in) thick, 99.9% (REO)
CAS: 7440-20-2 Molecular Formula: Sc Molecular Weight (g/mol): 44.96 MDL Number: MFCD00016323 InChI Key: SIXSYDAISGFNSX-UHFFFAOYSA-N Synonym: unii-yuj4u1ew7r,yuj4u1ew7r,escandio,skandium,atom,powder,ingot,nitrate solution,standard for aas,scandium, lump, vacuum remelted PubChem CID: 23952 ChEBI: CHEBI:33330 IUPAC Name: scandium SMILES: [Sc]
Hafnium foil, 1.0mm (0.04in) thick, annealed, 99.5% (metals basis excluding Zr), Zr nominal 3%, Thermo Scientific Chemicals
CAS: 7440-58-6 Molecular Formula: Hf Molecular Weight (g/mol): 178.49 MDL Number: MFCD00011032 InChI Key: VBJZVLUMGGDVMO-UHFFFAOYSA-N Synonym: hafnium, elemental,hafnio,celtium,unii-x71938l1do,and compounds,hsdb 552,powder,foil,atom,wire PubChem CID: 23986 ChEBI: CHEBI:33343 IUPAC Name: hafnium SMILES: [Hf]
Copper wire, 1.5mm (0.06in) dia, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Gold wire, 0.35mm (0.0138in) dia, Premion™, 99.999% (metals basis)
CAS: 7440-57-5 Molecular Formula: Au Molecular Weight (g/mol): 196.97 MDL Number: MFCD00003436 InChI Key: PCHJSUWPFVWCPO-UHFFFAOYSA-N Synonym: colloidal,powder,flake,leaf,gold, colloidal,burnish,shell,ci pigment metal 3,magnesium purple,c.i. pigment metal 3 PubChem CID: 23985 ChEBI: CHEBI:30050 IUPAC Name: gold SMILES: [Au]
Rhenium foil, 0.025mm (0.001in) thick, 99.97% (metals basis)
CAS: 7440-15-5 Molecular Formula: Re Molecular Weight (g/mol): 186.21 MDL Number: MFCD00011195 InChI Key: WUAPFZMCVAUBPE-UHFFFAOYSA-N Synonym: rhenium, elementar,renio,unii-7yhu292iny,7yhu292iny,foil,ion re7,rhenium, ion re7,atom,hydride,pellets PubChem CID: 23947 ChEBI: CHEBI:49882 IUPAC Name: rhenium SMILES: [Re]
Copper foil, 1.0mm (0.04in) thick, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]
Copper foil, 0.5mm (0.02in) thick, Puratronic™, 99.9999% (metals basis)
CAS: 7440-50-8 Molecular Formula: Cu Molecular Weight (g/mol): 63.55 MDL Number: MFCD00010965 InChI Key: RYGMFSIKBFXOCR-UHFFFAOYSA-N Synonym: cuprum,cobre,cuivre,blister,cathode,bronze,powder,anode,precipitates,kupfer PubChem CID: 23978 ChEBI: CHEBI:30052 IUPAC Name: copper SMILES: [Cu]